🤖 AI Analysis

Final verdict: SAFE

The package ViennaPS v4.5.0 exhibits minimal risk signals with no network calls, shell executions, or credential harvesting activities detected. The metadata risk is low, and there's no clear evidence of malicious intent.

No network calls detected
No shell execution patterns found
Low obfuscation risk

Per-check LLM notes

Network: No network calls detected, which is normal unless the package requires internet access for its functionality.
Shell: No shell execution patterns detected, indicating the package does not execute external commands.
Obfuscation: No obfuscation patterns detected, indicating low risk of malicious obfuscation.
Credentials: No credential harvesting patterns detected, indicating low risk of malicious credential theft.
Metadata: The package shows some low-effort signs but lacks clear indicators of malicious intent.

🔬 Heuristic Checks

✓ Outbound Network Calls

No suspicious network call patterns found

✓ Code Obfuscation

No obfuscation patterns detected

✓ Shell / Subprocess Execution

No shell execution patterns detected

✓ Credential Harvesting

No credential harvesting patterns detected

✓ Typosquatting

No typosquatting candidates detected

✓ Registered Email Domain

No author email provided

⚠ Suspicious Page Links score 2.0

Found 1 suspicious link(s) on the package page

Non-HTTPS external link: http://www.iue.tuwien.ac.at/

✓ Git Repository History

Repository ViennaTools/ViennaPS appears legitimate

⚠ Maintainer History score 6.0

3 maintainer concern(s) found

Author name is missing or very short
Author "" appears to have only 1 package on PyPI (new or inactive account)
Package has no PyPI classifiers (low effort / metadata quality)

✓ Known CVE Vulnerabilities

No known vulnerabilities found in OSV database.

💡 AI App Starter Prompt

Use this prompt to build a project with ViennaPS

Your task is to develop a user-friendly graphical application that simulates the topography of microelectronic fabrication processes using the ViennaPS package. This application will serve as a valuable tool for engineers and researchers to visualize and understand the complex topographical changes that occur during semiconductor manufacturing processes.

The application should include the following features:
1. A clean and intuitive GUI built using a popular Python GUI framework such as PyQt or Tkinter.
2. An input section where users can specify the parameters of the microelectronic fabrication process they wish to simulate, including material properties, processing conditions, and geometrical constraints.
3. Integration with the ViennaPS package to perform the topography simulations based on the user inputs.
4. A visualization module that displays the simulated topography in real-time or after the simulation has been completed. This could include 2D and 3D visualizations, contour plots, and cross-sectional views.
5. The ability to save the simulation results in various formats, such as image files (PNG, JPEG), data files (CSV, TXT), or even video files if applicable.
6. Optional advanced features such as the ability to compare multiple simulations side-by-side, apply different post-processing filters to the simulation results, or integrate with other microelectronic simulation tools for a more comprehensive analysis.

To utilize the ViennaPS package, you will need to familiarize yourself with its API and functions. Specifically, focus on how it handles the creation and manipulation of topography models, and how it can generate outputs suitable for visualization. Ensure that your application makes use of ViennaPS's core functionalities to provide accurate and insightful simulations of microelectronic fabrication processes.